The TS256MSK64V3N is a 256M x 64bits DDR3-1333 SO-DIMM. The TS256MSK64V3N consists of 8pcs 256Mx8bits DDR3 SDRAMs FBGA packages and a 2048 bits serial EEPROM on a 204-pin printed circuit board. The TS256MSK64V3N is a Dual In-Line Memory Module and is intended for mounting into 204-pin edge connector sockets.
Synchronous design allows precise cycle control with the use of system clock. Data I/O transactions are possible on both edges of DQS. Range of operation frequencies, programmable latencies allow the same device to be useful for a variety of high bandwidth, high performance memory system applications.
WARNING: Products with exposed solder can expose you to lead and lead compounds, chemicals known to the State of California to cause cancer, birth defects, or other reproductive harm. Always wash your hands after handling and avoid inhalation of fumes if heating the solder. For more information go to www.P65Warnings.ca.gov.
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